32-6518 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Mating	Type [custom]	Type [custom]	Type	Features	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post
Aries Electronics 32-6518-102	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin
Aries Electronics 32-6518-10M	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin
Aries Electronics 32-6518-10E	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin
Aries Electronics 32-6518-111	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	10 Áin	0.25 çm	0.25 µm	10 µin	Gold
Aries Electronics 32-6518-11	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	10 Áin	0.25 çm	0.25 µm	10 µin	Gold
Aries Electronics 32-6518-10T	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin
Aries Electronics 32-6518-10H	3 A	UL94 V-0	0.125 in	3.18 mm	32	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Through Hole	0.1 in	2.54 mm	Beryllium Copper	15.24 mm	0.6 in	DIP	Open Frame	Solder	Brass	200 µin	5.08 µm	0.25 µm	10 µin	Tin