20-3513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Mounting Type | Contact Material - Post [custom] | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Type | Type | Type | Number of Positions or Pins (Grid) | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Material - Mating | Features | Contact Finish - Mating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Tin | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Tin | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Tin | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Gold | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Tin | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | Through Hole | Brass | Solder | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | 20 | -55 C | 105 ░C | Gold | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled |