24-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Material - Post	Termination	Housing Material	Features	Contact Finish - Post	Contact Finish - Mating	Contact Material - Mating	Mounting Type	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post
Aries Electronics 24-3554-18	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm	Beryllium Nickel	Solder	Polyetheretherketone (PEEK) Glass Filled	Closed Frame	Nickel Boron	Nickel Boron	Beryllium Nickel	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	50 µin	1.27 µm	12	2	24	-55 C	250 °C	1.27 µm	50 µin	0.1 in	2.54 mm
Aries Electronics 24-3554-10	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm	Beryllium Copper	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Tin		Beryllium Copper	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	200 µin	5.08 µm	12	2	24			5.08 µm	200 µin	0.1 in	2.54 mm
Aries Electronics 24-3554-11	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm	Beryllium Copper	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Gold	Gold	Beryllium Copper	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in			12	2	24					0.1 in	2.54 mm