14-0518 Series

Catalog

14 PIN SOCKET

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating	Contact Finish - Mating	Features	Termination	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Type	Housing Material	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Number of Positions or Pins (Grid)
Aries Electronics 14-0518-10	0.125 in	3.18 mm	3 A	UL94 V-0	Beryllium Copper	Gold	Open Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	Tin	SIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	200 µin	5.08 µm	0.1 "	2.54 mm	Brass	14
Aries Electronics 14-0518-11	0.125 in	3.18 mm	3 A	UL94 V-0	Beryllium Copper	Gold	Open Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	Tin	SIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	200 µin	5.08 µm	0.1 "	2.54 mm	Brass	14
Aries Electronics 14-0518-10T	0.125 in	3.18 mm	3 A	UL94 V-0	Beryllium Copper	Gold	Open Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	Tin	SIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	200 µin	5.08 µm	0.1 "	2.54 mm	Brass	14
Aries Electronics 14-0518-00	0.046 in	1.17 mm	3 A	UL94 V-0	Beryllium Copper	Gold	Open Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	Tin	SIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Surface Mount	200 µin	5.08 µm	0.1 "	2.54 mm	Brass	14
Aries Electronics 14-0518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	Beryllium Copper	Gold	Open Frame	Solder	0.1 in	2.54 mm	0.25 µm	10 µin	Tin	SIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	200 µin	5.08 µm	0.1 "	2.54 mm	Brass	14