32-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish - Mating	Mounting Type	Contact Material - Post	Features	Contact Finish - Post	Contact Material - Mating	Type	Type	Type	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)
Aries Electronics 32-3554-18	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	50 µin	1.27 µm	1.27 µm	50 µin	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	Through Hole	Beryllium Nickel	Closed Frame	Nickel Boron	Beryllium Nickel	DIP ZIF (ZIP)	7.62 mm	0.3 in	-55 C	250 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	32
Aries Electronics 32-3554-10	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	200 µin	5.08 µm	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled		Through Hole	Beryllium Copper	Closed Frame	Tin	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in			0.1 in	2.54 mm	0.1 "	2.54 mm	32
Aries Electronics 32-3554-16	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	50 µin	1.27 µm	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	Through Hole	Beryllium Copper	Closed Frame	Nickel Boron	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in			0.1 in	2.54 mm	0.1 "	2.54 mm	32