14-8400 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 14POS TIN
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Type | Type | Type | Contact Material - Post | Housing Material | Features | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Termination | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3.56 mm | 0.14 in | 1 A | UL94 V-0 | 5.08 µm | 200 µin | Through Hole | 7.62 mm | 0.3 in | DIP | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame Elevated | 0.1 " | 2.54 mm | Tin | -55 C | 105 ░C | Phosphor Bronze | 200 µin | 5.08 µm | 14 | Solder | 0.1 in | 2.54 mm | ||
Aries Electronics | 3.56 mm | 0.14 in | 3 A | UL94 V-0 | 0.76 Ám | 30 Áin | Through Hole | 7.62 mm | 0.3 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame Elevated | 0.1 " | 2.54 mm | Gold | -55 C | 105 ░C | Beryllium Copper | 10 Áin | 0.25 çm | 14 | Solder | 0.1 in | 2.54 mm | Brass | Gold | |
Aries Electronics | 3.56 mm | 0.14 in | 1 A | UL94 V-0 | 5.08 µm | 200 µin | Through Hole | 7.62 mm | 0.3 in | DIP | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame Elevated | 0.1 " | 2.54 mm | Tin | -55 C | 105 ░C | Phosphor Bronze | 200 µin | 5.08 µm | 14 | Solder | 0.1 in | 2.54 mm |