21-0518 Series
Manufacturer: Aries Electronics
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⌘K
CONN SOCKET SIP 21POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Termination | Contact Material - Mating | Features | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Housing Material | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 1.17 mm | 0.046 in | 3 A | 200 µin | 5.08 µm | SIP | Solder | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 21 | 0.1 " | 2.54 mm | Tin | Gold | 0.25 µm | 10 µin | Surface Mount | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |
Aries Electronics | UL94 V-0 | 3.18 mm | 0.125 in | 3 A | 10 Áin | 0.25 çm | SIP | Solder | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 21 | 0.1 " | 2.54 mm | Gold | Gold | 0.25 µm | 10 µin | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |
Aries Electronics | UL94 V-0 | 3.18 mm | 0.125 in | 3 A | 200 µin | 5.08 µm | SIP | Solder | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 21 | 0.1 " | 2.54 mm | Tin | Gold | 0.25 µm | 10 µin | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |