16-8500 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 16POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Contact Finish - Post | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Mounting Type | Type [custom] | Type [custom] | Type | Housing Material | Contact Material - Post [custom] | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Mating | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 3.56 mm | 0.14 in | UL94 V-0 | -55 C | 105 ░C | 2 | 16 | 8 | Gold | Beryllium Copper | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | Through Hole | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass | Solder | 10 Áin | 0.25 çm | Closed Frame Elevated | Gold | ||
Aries Electronics | 3 A | 3.56 mm | 0.14 in | UL94 V-0 | -55 C | 105 ░C | 2 | 16 | 8 | Gold | Beryllium Copper | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | Through Hole | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass | Solder | 10 Áin | 0.25 çm | Closed Frame Elevated | Gold | 7.62 mm | 0.3 in |