16-1518 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Material - Post [custom]	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Type	Type	Housing Material
Aries Electronics 16-1518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	Brass	Gold	2	16	8	Solder	0.25 µm	10 µin	Beryllium Copper	Through Hole	Gold	10 Áin	0.25 çm	Open Frame	0.1 "	2.54 mm	0.1 in	2.54 mm	DIP	5.08 mm	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 16-1518-11	UL94 V-0	0.125 in	3.18 mm	3 A	Brass	Gold	2	16	8	Solder	0.25 µm	10 µin	Beryllium Copper	Through Hole	Gold	10 Áin	0.25 çm	Open Frame	0.1 "	2.54 mm	0.1 in	2.54 mm	DIP	5.08 mm	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 16-1518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Brass	Tin	2	16	8	Solder	0.25 µm	10 µin	Beryllium Copper	Through Hole	Gold	200 µin	5.08 µm	Open Frame	0.1 "	2.54 mm	0.1 in	2.54 mm	DIP	5.08 mm	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 16-1518-00	UL94 V-0	0.125 in	3.18 mm	3 A	Brass	Tin	2	16	8	Solder	0.25 µm	10 µin	Beryllium Copper	Surface Mount	Gold	200 µin	5.08 µm	Open Frame	0.1 "	2.54 mm	0.1 in	2.54 mm	DIP	5.08 mm	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 16-1518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	Brass	Tin	2	16	8	Solder	0.25 µm	10 µin	Beryllium Copper	Through Hole	Gold	200 µin	5.08 µm	Open Frame	0.1 "	2.54 mm	0.1 in	2.54 mm	DIP	5.08 mm	Polyamide (PA46) Nylon 4/6 Glass Filled