60-9503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 60POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish - Mating | Type | Type | Type | Contact Material - Post | Housing Material | Features | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.5 in | 12.7 mm | UL94 V-0 | 3 A | Gold | DIP | 22.86 mm | 0.9 in | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame | Through Hole | 30 | 2 | 60 | Beryllium Copper | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | -55 C | 125 °C | Gold | 0.1 " | 2.54 mm | Wire Wrap |
Aries Electronics | 0.5 in | 12.7 mm | UL94 V-0 | 3 A | Gold | DIP | 22.86 mm | 0.9 in | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame | Through Hole | 30 | 2 | 60 | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | -55 C | 105 ░C | Tin | 0.1 " | 2.54 mm | Wire Wrap |
Aries Electronics | 0.36 in | 9.14 mm | UL94 V-0 | 3 A | Gold | DIP | 22.86 mm | 0.9 in | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 Glass Filled | Closed Frame | Through Hole | 30 | 2 | 60 | Beryllium Copper | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | -55 C | 125 °C | Gold | 0.1 " | 2.54 mm | Wire Wrap |