28-3503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Contact Finish - Mating | Termination | Contact Finish - Post | Features | Pitch - Mating | Pitch - Mating | Mounting Type | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 9.14 mm | 0.36 in | 3 A | UL94 V-0 | 7.62 mm | 0.3 in | DIP | Gold | Wire Wrap | Tin | Closed Frame | 0.1 " | 2.54 mm | Through Hole | 0.1 in | 2.54 mm | 28 | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | -55 C | 105 ░C | Beryllium Copper | Phosphor Bronze | 0.25 µm | 10 µin |
Aries Electronics | 9.14 mm | 0.36 in | 3 A | UL94 V-0 | 7.62 mm | 0.3 in | DIP | Gold | Wire Wrap | Gold | Closed Frame | 0.1 " | 2.54 mm | Through Hole | 0.1 in | 2.54 mm | 28 | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | -55 C | 125 °C | Beryllium Copper | Phosphor Bronze | 0.25 µm | 10 µin |
Aries Electronics | 12.7 mm | 0.5 in | 3 A | UL94 V-0 | 7.62 mm | 0.3 in | DIP | Gold | Wire Wrap | Gold | Closed Frame | 0.1 " | 2.54 mm | Through Hole | 0.1 in | 2.54 mm | 28 | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | -55 C | 125 °C | Beryllium Copper | Phosphor Bronze | 0.25 µm | 10 µin |