44-3573 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Contact Finish - Post | Pitch - Post | Pitch - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | 2 22 | 44 | Tin | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | Closed Frame | Beryllium Copper | 5.08 µm | 200 µin | Through Hole | Beryllium Copper | |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | 2 22 | 44 | Gold | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 10 Áin | 0.25 çm | Closed Frame | Beryllium Copper | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | Gold |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | 2 22 | 44 | Nickel Boron | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 50 µin | 1.27 µm | Closed Frame | Beryllium Nickel | 1.27 µm | 50 µin | Through Hole | Beryllium Nickel | Nickel Boron |