28-526 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS TIN
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Number of Positions or Pins (Grid) | Housing Material | Pitch - Post | Pitch - Post | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Post | Type | Contact Finish - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.105 in | 2.67 mm | 3 A | 10 Áin | 0.25 çm | Closed Frame | 0.1 " | 2.54 mm | -55 C | 105 ░C | Beryllium Copper | 28 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Solder | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | DIP ZIF (ZIP) | Tin | |
 Aries Electronics | UL94 V-0 | 0.105 in | 2.67 mm | 3 A | 10 Áin | 0.25 çm | Closed Frame | 0.1 " | 2.54 mm | -55 C | 125 °C | Beryllium Copper | 28 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Solder | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | DIP ZIF (ZIP) | Gold | Gold |