40-6570 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Termination	Contact Material - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Pitch - Post	Pitch - Post	Type	Type	Contact Finish - Post	Features	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Contact Material - Post
Aries Electronics 40-6570-11	UL94 V-0	0.11 in	2.78 mm	1 A	Solder	Beryllium Copper	Gold	10 Áin	0.25 çm	Through Hole	0.1 in	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	0.25 µm	10 µin	40	0.1 "	2.54 mm	Beryllium Copper
Aries Electronics 40-6570-16	UL94 V-0	0.11 in	2.78 mm	1 A	Solder	Beryllium Nickel	Nickel Boron	50 µin	1.27 µm	Through Hole	0.1 in	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	40	0.1 "	2.54 mm	Beryllium Nickel
Aries Electronics 40-6570-10	UL94 V-0	0.11 in	2.78 mm	1 A	Solder	Beryllium Copper		200 µin	5.08 µm	Through Hole	0.1 in	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	40	0.1 "	2.54 mm	Beryllium Copper