Catalog
Bluetooth 5.0 Stereo Audio Module
Key Features
• Bluetooth 5 certified* A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP 1.2, SPP 1.2
• * Bluetooth classic (BR/EDR) and Bluetooth Low Energy (BLE)
• * General Attribute Profile (GATT) and General Access Profile (GAP)
• * I2S and analog audio outputs
• * UART firmware update
• * Transparent UART mode
• * Class 2 module (+2 dBm TX power); Class 1 module (+15 dBm TX power)
• * PCB antenna
• * Compact surface mount module
• * System configuration with GUI UI tools
• * FCC, Canada (IC), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (JRF), and China (SRRC) certified
Description
AI
The BM64 stereo audio module is a fully-certified Bluetooth 5 module for designers who want to add Bluetooth wireless audio and voice applications to their products.
This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package. This stereo module has integrated Li-Ion charger and I2S digital audio interface. It supports HSP, HFP, SPP, A2DP (Sink), and AVRCP profiles and AAC and SBC decoding.
Bluetooth Low Energy supports standard Generic Access Service, Device Information Service and a proprietary service for data communication.
Microchip’s Wireless
Concert Technology (WCT) for speakers uses Multi-Speaker (MSPK)
firmware to stream A2DP music to multiple speakers from one audio source, such
as a smartphone. This unique solution delivers tight synchronization
among the speakers to deliver uninterrupted, distributed
audio. Use personal sharing groups to easily pair speakers and assign
master and slave roles via the Microchip Bluetooth Audio (MBA) Mobile app.
Consider using the latest Bluetooth Audio solution, [BM83](https://www.microchip.com/wwwproducts/en/BM83).
| | | | | |
| --- | --- | --- | --- | --- |
| **CPN** | **Shield** | **Class** | **Programmed Firmware** | **Note** |
| BM64SPKS1MC1-000**3AA** | Yes | 1 | [DSPK2.1.5](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x_DSPK_v2.1.5_Package.zip) | Fixed SweynTooth and BIAS vulnerabilities. [See Release Notes.](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x_DSPK_v2.1.5_Release_Notes.pdf) |
| BM64SPKS1MC2-000**3AA** | Yes | 2 | [DSPK2.1.5](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x_DSPK_v2.1.5_Package.zip) | Fixed SweynTooth and BIAS vulnerabilities. [See Release Notes.](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x_DSPK_v2.1.5_Release_Notes.pdf) |
| BM64SPKS1MC2-0002AA | Yes | 2 | [DSPK2.1.2](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x_DSPK_v2.1.5_Package.zip) | Bluetooth SIG BR/EDR security patch added(CERT VU#918987). [See Release Notes](https://ww1.microchip.com/downloads/en/DeviceDoc/BM6x%20DSPK%202.1.3%20Release%20Notes.pdf) |
| BM64SPKS1MC1-00**M2AA** | Yes | 1 | [MSPK1.3.5](https://ww1.microchip.com/downloads/en/DeviceDoc/BM64%20Software%20&%20Tools%20(MSPKv1.35).zip) | Wireless Concert Technology. See MSPK1.3.5 Release Notes. Latest Firmware: [MSPK1.3.11](https://www.microchip.com/en-us/product/BM64%20MSPK%20v1.3.11); [MSPK1.3.11 Release Notes](https://ww1.microchip.com/downloads/en/DeviceDoc/BM64_MSPK_v1.3.11_Release_Notes.pdf) |
| BM64SPKA1MC1-0001AA | No | 1 | DSPK1.1 | Initial Release. Not recommended for new designs |
| BM64SPKS1MC1-0001AA | Yes | 1 | DSPK1.1 | Initial Release. Not recommended for new designs |
| BM64SPKA1MC2-0001AA | No | 2 | DSPK1.1 | Initial Release. Not recommended for new designs |
| BM64SPKS1MC2-0001AA | Yes | 2 | DSPK1.1 | Initial Release. Not recommended for new designs |
