40-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Contact Material - Post	Housing Material	Features	Type	Type	Type	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 40-3553-18	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Solder	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	40	50 µin	1.27 µm	Beryllium Nickel	0.1 "	2.54 mm	Through Hole	1.27 µm	50 µin	Nickel Boron	-55 C	250 °C
Aries Electronics 40-3553-16	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Solder	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	40	50 µin	1.27 µm	Beryllium Copper	0.1 "	2.54 mm	Through Hole	1.27 µm	50 µin	Nickel Boron
Aries Electronics 40-3553-11	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Solder	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	40			Beryllium Copper	0.1 "	2.54 mm	Through Hole			Gold