IS1870SF Series

Bluetooth Low Energy System on a Chip

Catalog

Bluetooth Low Energy System on a Chip

Part	Current - Receiving	Supplier Device Package	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Current - Transmitting	GPIO	Frequency [Max]	Frequency [Min]	Sensitivity	RF Family/Standard	Memory Size	Power - Output	Type	Protocol	Serial Interfaces	Voltage - Supply [Max]	Voltage - Supply [Min]	Mounting Type	Data Rate (Max)
Microchip Technology IS1870SF-202	10 mA	48-QFN (6x6)	48-VFQFN Exposed Pad	85 °C	-40 °C	10 mA	31	2.48 GHz	2.402 GHz	-90 dBm	Bluetooth	24 kB 32 kB 256 kB	0 dBm	TxRx + MCU	Bluetooth v5.0	ADC I2C PWM SPI UART	3.6 V	1.9 V	Surface Mount	921.6 kbps
Microchip Technology IS1870SF-102-TRAY	13 mA	48-QFN (6x6)	48-VFQFN Exposed Pad	70 °C	-20 °C	13 mA	31	2.48 GHz	2.402 GHz	-90 dBm	Bluetooth	24 kB 32 kB 256 kB	0 dBm	TxRx + MCU	Bluetooth v5.0	ADC I2C PWM SPI UART	3.6 V	1.9 V	Surface Mount	921.6 kbps

Catalog

Bluetooth Low Energy System on a Chip

Key Features

- Bluetooth 5 Certified

- 1.9V~3.6V (VDD) operating range

- Low-power consumption

- Average current: TX 3.87mA/RX 3.06mA with Buck,@ VBAT=3.0V and 18.75ms Connection Interval

- UART interface

- Main X’tal : 32MHz

- 256K Bytes embedded flash memory

- Temperature sensor supported

- Flexible GPIO pin configuration

- 3 channels PWM supported

- 16-ch 12 bits ADC supported for battery and voltage detection

- Provides proprietary BeaconThings® service

- ISM Band 2.402 to 2.480 GHz operation

- Channels 0-39

- Rx sensitivity: -90dBm@ BLE, typical

- Programmable Tx Power: -25 to +3 dBm

- RSSI monitor

- Available in certified modules BM70

Description

Microchip's IS1870 BLE ICs are designed for App-enabled accessories and IoT (Internet of Things) through Bluetooth® LE connectivity. It is available in the 2.4GHz ISM band radio, and is certified to Bluetooth Core Specification Version 5.0. The IS1870 allows customers to finish their design faster and more efficiently. It combines both the transceiver and baseband functions to decrease the external components. In addition, the free Bluetooth stack firmware is provided enabling products to quickly become embedded Bluetooth LE solution. For portable and wearable applications, the product's optimized power design minimizes current consumption for extended battery life and minimal package size. **The** [**BM-70-PICtail**](https://www.microchip.com/en-us/development-tool/bm-70-pictail) **or** [**BM70**](https://www.microchip.com/en-us/product/BM70) **modules are recommended for evaluation. Please contact your authorized Microchip representative if IC samples are required.** **Firmware Release Summary, see Software Release Notes for details:** FW 2.04 (online only) - fixed ANSII vulnerabilities and other bugs for IS1870, IS1871, BM70, BM71. BM70BLEx1FC2-0B05BA - FW 2.03 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware version 2.0.3 adds new features/ removes limitations in previous release 1.11 and fixes Sweyntooth vulnerability. BM70BLEx1FC2-0B04AA - FW 1.11 - Fixes bug with invalid Bluetooth address. Refer to Errata document for more information. BM70BLEx1FC2-0B03AA - FW 1.06 - Added support for the [BM71](https://www.microchip.com/en-us/product/BM71) among other bug fixes. BM70BLEx1FC2-0002AA - FW 1.03 - Initial Release.