48-6503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Features | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Type [custom] | Type [custom] | Type | Housing Material | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 V-0 | Closed Frame | Through Hole | Gold | 200 µin | 5.08 µm | -55 C | 105 ░C | Tin | 0.1 " | 2.54 mm | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Phosphor Bronze | 0.25 µm | 10 µin | 2 | 48 | 24 | Wire Wrap |
Aries Electronics | 3 A | 0.36 in | 9.14 mm | UL94 V-0 | Closed Frame | Through Hole | Gold | 10 Áin | 0.25 çm | -55 C | 125 °C | Gold | 0.1 " | 2.54 mm | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Phosphor Bronze | 0.25 µm | 10 µin | 2 | 48 | 24 | Wire Wrap |
Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 V-0 | Closed Frame | Through Hole | Gold | 10 Áin | 0.25 çm | -55 C | 125 °C | Gold | 0.1 " | 2.54 mm | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Phosphor Bronze | 0.25 µm | 10 µin | 2 | 48 | 24 | Wire Wrap |