48-3575 Series
Manufacturer: Aries Electronics
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CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Material - Mating | Type | Type | Type | Termination | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Beryllium Copper | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 5.08 µm | 200 µin | Closed Frame | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | 2 | 48 | 24 | Tin |
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Beryllium Copper | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 5.08 µm | 200 µin | Closed Frame | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | 2 | 48 | 24 | Tin |