625-35 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK FOR 25MM BGA
| Part | Shape | Attachment Method | Package Cooled | Type | Width [x] | Width [x] | Length | Length [x] | Thermal Resistance @ Forced Air Flow | Material Finish | Material | Fin Height [custom] | Fin Height [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Pin Fins Square | Thermal Tape Adhesive (Included) | BGA | Top Mount | 25 mm | 0.984 " | 25 mm | 0.984 in | 13.1 °C/W | Black Anodized | Aluminum | 8.89 mm | 0.35 " |
Wakefield Thermal Solutions | Pin Fins Square | Thermal Tape Adhesive (Included) | BGA | Top Mount | 25 mm | 0.984 " | 25 mm | 0.984 in | 13.1 °C/W | Black Anodized | Aluminum | 8.89 mm | 0.35 " |