36-6554 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Type | Type | Housing Material | Mounting Type | Contact Material - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Termination | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Polyetheretherketone (PEEK) Glass Filled | Through Hole | Beryllium Nickel | 0.1 " | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | -55 C | 250 °C | Closed Frame | 50 µin | 1.27 µm | Beryllium Nickel | 0.1 in | 2.54 mm | 36 | Solder | Nickel Boron |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | 0.1 " | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | Closed Frame | 50 µin | 1.27 µm | Beryllium Copper | 0.1 in | 2.54 mm | 36 | Solder | Nickel Boron |