40-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Mounting Type	Type	Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Termination	Contact Material - Post	Features	Housing Material
Aries Electronics 40-6554-18	UL94 V-0	1 A	0.11 in	2.78 mm	40	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	50 µin	1.27 µm	0.1 in	2.54 mm	Nickel Boron	-55 C	250 °C	Beryllium Nickel	1.27 µm	50 µin	0.1 "	2.54 mm	Solder	Beryllium Nickel	Closed Frame	Polyetheretherketone (PEEK) Glass Filled
Aries Electronics 40-6554-10	UL94 V-0	1 A	0.11 in	2.78 mm	40	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	200 µin	5.08 µm	0.1 in	2.54 mm				Beryllium Copper	5.08 µm	200 µin	0.1 "	2.54 mm	Solder	Beryllium Copper	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 40-6554-16	UL94 V-0	1 A	0.11 in	2.78 mm	40	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	50 µin	1.27 µm	0.1 in	2.54 mm	Nickel Boron			Beryllium Copper	1.27 µm	50 µin	0.1 "	2.54 mm	Solder	Beryllium Copper	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 40-6554-11	UL94 V-0	1 A	0.11 in	2.78 mm	40	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Gold			0.1 in	2.54 mm	Gold			Beryllium Copper			0.1 "	2.54 mm	Solder	Beryllium Copper	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled