Integrated Circuits (ICs)

TE0803-03-2AE11-A

Obsolete

IC MODULE ZYNQ USCALE 2GB 128MB

Integrated Circuits (ICs)

Obsolete

IC MODULE ZYNQ USCALE 2GB 128MB

Technical Specifications

Parameters and characteristics for this part

Specification	TE0803-03-2AE11-A

Connector Type	B2B
Core Processor	Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size	128 MB
Module/Board Type	MPU Core
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	0 °C
RAM Size	2 GB
Size / Dimension Length	2.05 in
Size / Dimension Width	2.99 in

Part	Flash Size	Module/Board Type	Size / Dimension Length	Size / Dimension Width	Operating Temperature (Max)	Operating Temperature (Min)	RAM Size	Core Processor	Connector Type
Trenz Electronic TE0803-03-4DE11-A	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU4EV-1SFVC784E	B2B
Trenz Electronic TE0803-03-4DE21-L	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	4 GB	Zynq UltraScale+ XCZU4EV-1SFVC784E	B2B
Trenz Electronic TE0803-01-04CG-1EA	128 MB	MPU Core	2.99 in	2.05 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU4CG-1SFVC784E	B2B
Trenz Electronic TE0803-03-5DI21-A
Trenz Electronic TE0803-03-5DE11-A	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU5EV-1SFVC784E	B2B
Trenz Electronic TE0803-03-2AE11-A	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU2CG-1SFVC784E	B2B
Trenz Electronic TE0803-03-2BE11-A	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU2EG-1SFVC784E	B2B
Trenz Electronic TE0803-03-3AE11-A	128 MB	MPU Core	2.05 in	2.99 in	85 °C	0 °C	2 GB	Zynq UltraScale+ XCZU2CG-1SFVC784E	B2B

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

3D models and CAD resources for this part

General part information

TE0803 Embedded Module Zynq UltraScale+ XCZU2CG-1SFVC784E 2GB 128MB

Technical documentation and resources

No documents available