
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | EP2C70F896I8 |
|---|---|
| Mounting Type | Surface Mount |
| Number of I/O | 622 |
| Number of LABs/CLBs | 4276 |
| Number of Logic Elements/Cells | 68416 |
| Operating Temperature [Max] | 100 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 896-BGA |
| Supplier Device Package | 896-FBGA |
| Supplier Device Package [x] | 31 |
| Supplier Device Package [y] | 31 |
| Total RAM Bits | 1152000 Bits |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 816.94 | |
| Tray | 27 | $ 816.94 | ||
Description
General part information
EP2C70 Series
Cyclone® II Field Programmable Gate Array (FPGA) IC 622 1152000 68416 896-BGA
Documents
Technical documentation and resources