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Integrated Circuits (ICs)
LPC55S16JBD100Y
ActiveFreescale Semiconductor - NXP
ARM MCU, 32-BIT, ARM CORTEX-M33, 150 MHZ, 256 KILOBYTES, 96 KILOBYTES, 100 PINS, HLQFP
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Integrated Circuits (ICs)
LPC55S16JBD100Y
ActiveFreescale Semiconductor - NXP
ARM MCU, 32-BIT, ARM CORTEX-M33, 150 MHZ, 256 KILOBYTES, 96 KILOBYTES, 100 PINS, HLQFP
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | LPC55S16JBD100Y |
|---|---|
| Connectivity | Flexcomm, UART/USART, I2C, CAN FD, SPI, USB |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 10x16b SAR |
| Mounting Type | Surface Mount |
| Number of I/O | 64 |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | External, Internal |
| Package / Case | 100-LQFP Exposed Pad |
| Peripherals | WDT, POR, PWM, Brown-out Detect/Reset, DMA, I2S, RNG |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| RAM Size | 96 K |
| Speed | 150 MHz |
| Supplier Device Package | 100-HLQFP (14x14) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
LPC55S16 Series
256KB flash, 96KB total SRAM, CASPER crypto/FFT engine, RNG, CANFD, 64 GPIO, USB FS + HS
Secure boot, PRINCE model, PUF controller, HASH-AES, TrustZone
Operating temperature range from -40°C to +105°C, HLQFP100 package
Documents
Technical documentation and resources