Zenode.ai Logo
Beta
ISL54210 Functional Diagram
Integrated Circuits (ICs)

ISL54210IRTZ-T

Obsolete
Renesas Electronics Corporation

MP3/USB 2.0 HIGH-SPEED SWITCH WITH NEGATIVE SIGNAL HANDLING/CLICK AND POP SUPPRESSION

Deep-Dive with AI

Search across all available documentation for this part.

ISL54210 Functional Diagram
Integrated Circuits (ICs)

ISL54210IRTZ-T

Obsolete
Renesas Electronics Corporation

MP3/USB 2.0 HIGH-SPEED SWITCH WITH NEGATIVE SIGNAL HANDLING/CLICK AND POP SUPPRESSION

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationISL54210IRTZ-T
-3db Bandwidth700 MHz
ApplicationsUSB, Audio
FeaturesDepop, USB 2.0
Mounting TypeSurface Mount
Multiplexer/Demultiplexer Circuit2:1
Number of Channels [custom]2
On-State Resistance (Max)2.8 Ohm, 6 Ohm
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case10-VFDFN Exposed Pad
Supplier Device Package10-TDFN (3x3)
Switch CircuitSPDT
Voltage - Supply, Single (V+) [Max]3.6 V
Voltage - Supply, Single (V+) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

ISL54210 Series

The ISL54210 dual Single Pole/Double Throw (SPDT) switch combines low distortion audio and accurate USB 2.0 High-Speed data (480Mbps) signal switching in the same low voltage device. When operated with a 2.7V to 3.6V single supply, these analog switches allow audio signal swings below-ground, allowing the use of a common USB and audio headphone connector in personal media players and other portable battery-powered devices. The ISL54210 incorporates circuitry for the detection of the USB VBUSvoltage, which is used to switch between the audio and USB signal sources. It has an enable pin (CTRL) to open all switches and activate the audio click/pop (C/P) circuitry. The high off-isolation and special C/P circuitry of the audio switches eliminate clicks and pops in the headphones when the audio CODEC drivers are powering up/down or when a headphone is inserted or removed from the jack. It's available in a tiny 10 Ld 1.8mm x 1.4mm ultra-thin µTQFN package and a 10 Ld 3mm x 3mm TDFN package. It operates over a temperature range of -40 °C to +85 °C.

Documents

Technical documentation and resources