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ROHM SCT3160KWAHRTL
Discrete Semiconductor Products

SCT3160KWATL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 17 A, 1.2 KV, 0.208 OHM, TO-263

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ROHM SCT3160KWAHRTL
Discrete Semiconductor Products

SCT3160KWATL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 17 A, 1.2 KV, 0.208 OHM, TO-263

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3160KWATL
Current - Continuous Drain (Id) @ 25°C17 A
Drain to Source Voltage (Vdss)1.2 kV
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]42 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]398 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-263CA, D2PAK (7 Leads + Tab), TO-263-8
Rds On (Max) @ Id, Vgs208 mOhm
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 9.50
10$ 6.58
25$ 5.83
100$ 4.99
250$ 4.58
500$ 4.33
Digi-Reel® 1$ 9.50
10$ 6.58
25$ 5.83
100$ 4.99
250$ 4.58
500$ 4.33
N/A 976$ 9.13
Tape & Reel (TR) 1000$ 4.12
2000$ 4.03
NewarkEach (Supplied on Cut Tape) 1$ 8.06
10$ 6.91
25$ 6.58
50$ 6.26
100$ 5.94
250$ 5.74
500$ 5.53

Description

General part information

SCT3160KWA Series

SCT3160KWA is an SiC (Silicon Carbide) trench MOSFET. Features include high voltage resistance, low ON resistance, and fast switching speed.

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the ELV directive

Environmental Data

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

4 Steps for Successful Thermal Designing of Power Devices

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use Thermal Models

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

Design Method for Comparator-less Miller Clamp Circuits

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

TO-263-7LA Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

SiC MOSFET Layout Design Considerations

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units

White Paper

Gate-source voltage behaviour in a bridge configuration

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

TO-263-7LA Package Dimensions

Package Information

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Anti-Whisker formation

Package Information

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

How to Use PLECS Models

Technical Article

What is a Thermal Model? (SiC Power Device)

Thermal Design

SCT3160KWA Data Sheet

Data Sheet

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

800V Three-Phase Output LLC DC/DC Resonant Converter

Schematic Design & Verification

How to Use PSIM Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Administration Regulations (EAR)

Export Information