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Discrete Semiconductor Products

BM63374S-VA

Active
Rohm Semiconductor

INTELLIGENT POWER MODULE (IPM), IGBT, 600 V, 15 A, 1.5 KV, DIPIPM

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Search across all available documentation for this part.

DocumentsCompliance of the ELV directivePCB Layout Thermal Design Guide+22
Product thumbnail image
Discrete Semiconductor Products

BM63374S-VA

Active
Rohm Semiconductor

INTELLIGENT POWER MODULE (IPM), IGBT, 600 V, 15 A, 1.5 KV, DIPIPM

Deep-Dive with AI

DocumentsCompliance of the ELV directivePCB Layout Thermal Design Guide+22

Technical Specifications

Parameters and characteristics for this part

SpecificationBM63374S-VA
Configuration3 Phase Inverter
Current15 A
Mounting TypeThrough Hole
Package / Case25-PowerDIP Module (1.134", 28.80mm)
TypeIGBT
Voltage600 V
Voltage - Isolation1500 VAC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 25.06
Tube 1$ 12.75
60$ 7.09
120$ 6.59
540$ 6.27
NewarkEach 1$ 24.41
5$ 22.97
10$ 21.53
25$ 15.66
50$ 15.66
120$ 15.65
300$ 15.65

Description

General part information

BM63374 Series

BM63374S-VA/-VC is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes.

Documents

Technical documentation and resources

Compliance of the ELV directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

BM63374S-VA Data Sheet

Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

600V IGBT Gen.3 Intelligent Power Module (IPM) BM6337*S, BM6357*S Series Application Note

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Anti-Whisker formation

Package Information

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design