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Discrete Semiconductor Products

RBQ10BM100AFHTL

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Rohm Semiconductor

LOW IR, 100V, 10A, TO-252 (DPAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

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Product thumbnail image
Discrete Semiconductor Products

RBQ10BM100AFHTL

Active
Rohm Semiconductor

LOW IR, 100V, 10A, TO-252 (DPAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBQ10BM100AFHTL
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr80 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If770 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.16
10$ 1.38
100$ 0.94
500$ 0.75
1000$ 0.68
Digi-Reel® 1$ 2.16
10$ 1.38
100$ 0.94
500$ 0.75
1000$ 0.68
Tape & Reel (TR) 2500$ 0.62
5000$ 0.58
NewarkEach (Supplied on Cut Tape) 1$ 2.00
10$ 1.32
25$ 1.28
50$ 1.09
100$ 0.91
250$ 0.90
500$ 0.73
1000$ 0.68

Description

General part information

RBQ10NS100AFH Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Inner Structure

Package Information

Taping Information

Package Information

Reliability Test Result

Manufacturing Data

Diode Types and Applications

Technical Article

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Electrical Static Discharge Immunity

Characteristics Data

How to Select Rectifier Diodes

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Explanation for Marking

Package Information

Part Explanation

Application Note

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information