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TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6X8TR

Active
Rohm Semiconductor

NPN+NPN, SOT-363T, DRIVER TRANSISTOR

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TUMT6_TUMT6 Pkg
Discrete Semiconductor Products

US6X8TR

Active
Rohm Semiconductor

NPN+NPN, SOT-363T, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationUS6X8TR
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition320 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power - Max [Max]400 mW
Supplier Device PackageTUMT6
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic350 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
Digi-Reel® 1$ 0.57
10$ 0.49
100$ 0.34
500$ 0.28
1000$ 0.24
N/A 2970$ 0.95
Tape & Reel (TR) 3000$ 0.22
6000$ 0.20
9000$ 0.19
30000$ 0.19

Description

General part information

US6X8 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

US6X8 Data Sheet

Data Sheet

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

Package Dimensions

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

US6X8 ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design