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Discrete Semiconductor Products

RRU1LAM4STR

NRND
Rohm Semiconductor

DIODE GEN PURP 400V 1A PMDTM

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Product dimension image
Discrete Semiconductor Products

RRU1LAM4STR

NRND
Rohm Semiconductor

DIODE GEN PURP 400V 1A PMDTM

Technical Specifications

Parameters and characteristics for this part

SpecificationRRU1LAM4STR
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
Reverse Recovery Time (trr)400 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]400 V
Voltage - Forward (Vf) (Max) @ If [Max]1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.42
10$ 0.36
100$ 0.25
500$ 0.20
1000$ 0.16
Digi-Reel® 1$ 0.42
10$ 0.36
100$ 0.25
500$ 0.20
1000$ 0.16
N/A 3508$ 0.55
Tape & Reel (TR) 3000$ 0.14
6000$ 0.14
9000$ 0.13
30000$ 0.12
75000$ 0.12

Description

General part information

RRU1LAM4 Series

RRU1LAM4STF is the high reliability automotive Standard Rectifier Diode, suitable for general rectification.

Documents

Technical documentation and resources

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Part Explanation

Application Note

How to Select Rectifier Diodes

Technical Article

About Export Regulations

Export Information

About Flammability of Materials

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Compliance of the RoHS directive

Environmental Data

Explanation for Marking

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Diode Types and Applications

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RRU1LAM4S ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RRU1LAM4S Data Sheet

Data Sheet