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YZF-8-BGA Pkg
Sensors, Transducers

TMP007AIYZFT

Obsolete
Texas Instruments

INFRARED THERMOPILE CONTACTLESS TEMPERATURE SENSOR WITH INTEGRATED MATH ENGINE IN WCSP PACKAGE

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YZF-8-BGA Pkg
Sensors, Transducers

TMP007AIYZFT

Obsolete
Texas Instruments

INFRARED THERMOPILE CONTACTLESS TEMPERATURE SENSOR WITH INTEGRATED MATH ENGINE IN WCSP PACKAGE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTMP007AIYZFT
Accuracy - Highest (Lowest)1 °C
FeaturesOne-Shot, Output Switch, Shutdown Mode
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output TypeI2C/SMBus
Resolution14 b
Sensing Temperature - Local [Max]125 °C
Sensing Temperature - Local [Min]-40 °C
Sensor TypeInfrared (IR), Digital
Supplier Device Package8-DSBGA
Test Condition [Max]125 °C
Test Condition [Min]-40 °C
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

TMP007 Series

The TMP007 is a fully-integrated microelectro-mechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 µm to 16 µm within the end-user defined field of view.

The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature. The TMP007 also provides nonvolatile memory for storing calibration coefficients.

The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes. Low power consumption also makes it well suited for battery-powered applications.

Documents

Technical documentation and resources

No documents available