Zenode.ai Logo
Beta
Product Image
Connectors, Interconnects

ESQT-104-03-H-T-375

Active
Samtec Inc.

2MM 2MM 4.5A TRIPLE ROW GOLD -55℃~+125℃ 12P STRAIGHT 9.53MM PLUGIN,P=2MM FEMALE HEADERS ROHS

Deep-Dive with AI

Search across all available documentation for this part.

Product Image
Connectors, Interconnects

ESQT-104-03-H-T-375

Active
Samtec Inc.

2MM 2MM 4.5A TRIPLE ROW GOLD -55℃~+125℃ 12P STRAIGHT 9.53MM PLUGIN,P=2MM FEMALE HEADERS ROHS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationESQT-104-03-H-T-375
Connector TypeElevated Socket
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact Length - Post0.083 in
Contact Length - Post2.11 mm
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeForked
Current Rating (Amps)4.5 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.375 in
Insulation Height9.53 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions12
Number of Positions LoadedAll
Number of Rows3
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating [x]0.079 in
Pitch - Mating [x]2 mm
Row Spacing - Mating0.079 in
Row Spacing - Mating2 mm
StyleBoard to Board, Cable
TerminationSolder
...
PartMounting TypeContact Finish - MatingContact TypeFastening TypeOperating Temperature [Min]Operating Temperature [Max]Contact Finish - PostInsulation MaterialPitch - Mating [x]Pitch - Mating [x]Contact ShapeConnector TypeInsulation HeightInsulation HeightContact Finish Thickness - MatingContact Finish Thickness - MatingContact MaterialNumber of PositionsNumber of Positions LoadedNumber of RowsContact Length - PostContact Length - PostCurrent Rating (Amps)TerminationStyleRow Spacing - MatingRow Spacing - MatingInsulation ColorMaterial Flammability RatingContact Length - Post [x]Contact Finish Thickness - PostContact Finish Thickness - PostContact Length - Post [x]
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
9.02 mm
0.355 in
3 µin
0.076 µm
Phosphor Bronze
8
All
2
0.495 in
12.57 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Gold
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
9.78 mm
0.385 in
20 µin
0.51 µm
Phosphor Bronze
8
All
2
1.85 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0
0.073 "
3 µin
0.076 µm
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
9.27 mm
0.365 in
3 µin
0.076 µm
Phosphor Bronze
4
All
1
0.093 in
2.35 mm
4.5 A
Solder
Board to Board
Cable
Black
UL94 V-0
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
3 µin
0.076 µm
Phosphor Bronze
8
All
2
0.44 in
11.18 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
15.49 mm
0.61 in
10 çin
0.25 çm
Phosphor Bronze
4
All
1
6.1 mm
4.5 A
Solder
Board to Board
Cable
Black
UL94 V-0
0.24 in
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Gold
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
9.53 mm
0.375 in
30 Áin
0.76 Ám
Phosphor Bronze
12
All
3
0.083 in
2.11 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0
3 µin
0.076 µm
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Gold
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
10.92 mm
0.43 in
20 µin
0.51 µm
Phosphor Bronze
4
All
1
4.5 A
Solder
Board to Board
Cable
Black
UL94 V-0
0.42 in
3 µin
0.076 µm
10.67 mm
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
18.8 mm
0.74 in
3 µin
0.076 µm
Phosphor Bronze
8
All
2
2.79 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0
0.11 in
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Gold
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
7.87 mm
0.31 in
20 µin
0.51 µm
Phosphor Bronze
4
All
1
0.148 in
3.76 mm
4.5 A
Solder
Board to Board
Cable
Black
UL94 V-0
3 µin
0.076 µm
Through Hole
Gold
Forked
Push-Pull
-55 °C
125 °C
Tin
Liquid Crystal Polymer (LCP)
0.079 in
2 mm
Square
Elevated Socket
10.8 mm
0.425 in
10 çin
0.25 çm
Phosphor Bronze
8
All
2
0.425 in
10.8 mm
4.5 A
Solder
Board to Board
Cable
0.079 in
2 mm
Black
UL94 V-0

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 11.28
LCSCPiece 1$ 17.18
200$ 6.86
500$ 6.63
1000$ 6.51

Description

General part information

ESQT-104 Series

12 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available