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Discrete Semiconductor Products

US5U1TR

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Rohm Semiconductor

MOSFET N-CH 30V 1.5A TUMT5

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Discrete Semiconductor Products

US5U1TR

Active
Rohm Semiconductor

MOSFET N-CH 30V 1.5A TUMT5

Technical Specifications

Parameters and characteristics for this part

SpecificationUS5U1TR
Current - Continuous Drain (Id) @ 25°C1.5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]2.5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET FeatureSchottky Diode (Isolated)
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs2.2 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]80 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD (5 Leads), Flat Leads
Power Dissipation (Max)1 W
Rds On (Max) @ Id, Vgs240 mOhm
Supplier Device PackageTUMT5
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2719$ 0.64

Description

General part information

US5U1 Series

ROHM MOSFETs are made as low RDS(on) resistance devices utilizing the micro-processing technologies and available in wide lineup including hybrid types (MOSFET + Schottky Barrier Diode) to meet various needs in the market.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Constitution Materials List

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

About Export Regulations

Export Information

How to Create Symbols for PSpice Models

Models

P-channel Power MOSFETs selection guide

Technical Article

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Package Dimensions

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What Is Thermal Design

Thermal Design

ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

US5U1 Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design