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Discrete Semiconductor Products

RK7002BMHZGT116

Active
Rohm Semiconductor

MOSFET, AEC-Q101, N-CH, 60V, SOT-23

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Product thumbnail image
Discrete Semiconductor Products

RK7002BMHZGT116

Active
Rohm Semiconductor

MOSFET, AEC-Q101, N-CH, 60V, SOT-23

Technical Specifications

Parameters and characteristics for this part

SpecificationRK7002BMHZGT116
Current - Continuous Drain (Id) @ 25°C250 mA
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 2.5 V
FET TypeN-Channel
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds15 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power Dissipation (Max)350 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs2.4 Ohm
Supplier Device PackageSST3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1671$ 0.20
NewarkEach (Supplied on Cut Tape) 1$ 0.20
10$ 0.12
25$ 0.10
50$ 0.07
100$ 0.05
250$ 0.05
500$ 0.05
1000$ 0.04

Description

General part information

RK7002BMHZG Series

RK7002BMHZGis the high reliability Automotive MOSFET, suitable for switching and low-side load switch, relay driver.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

What Is Thermal Design

Thermal Design

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

Judgment Criteria of Thermal Evaluation

Thermal Design

Package Dimensions

Package Information

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Types and Features of Transistors

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

RK7002BMHZG Data Sheet

Data Sheet

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design