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R6004KNXC7G
Discrete Semiconductor Products

RCX300N20

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Rohm Semiconductor

MOSFET N-CH 200V 30A TO220FM

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R6004KNXC7G
Discrete Semiconductor Products

RCX300N20

Active
Rohm Semiconductor

MOSFET N-CH 200V 30A TO220FM

Technical Specifications

Parameters and characteristics for this part

SpecificationRCX300N20
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)200 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs60 nC
Input Capacitance (Ciss) (Max) @ Vds3200 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)40 W, 2.23 W
Rds On (Max) @ Id, Vgs80 mOhm
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1.83
10$ 1.52
100$ 1.21
500$ 1.02
1000$ 0.87
2000$ 0.83
5000$ 0.80
10000$ 0.77
N/A 90$ 2.64

Description

General part information

RCX300N20 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Transistor, MOSFET Flammability

Related Document

TO220FM Inner Structure

Related Document

TO-220FM Part Marking

Related Document

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RCX300N20 Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Reliability Test Result

Manufacturing Data

List of Transistor Package Thermal Resistance

Thermal Design

ESD Data

Characteristics Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design