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TOREX XP261N70027R-G
Discrete Semiconductor Products

DAP222ZMT2L

Active
Rohm Semiconductor

HIGH SPEED SWITCHING, 80V 100MA, SOT-723, ANODE COMMON SWITCHING DIODE

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TOREX XP261N70027R-G
Discrete Semiconductor Products

DAP222ZMT2L

Active
Rohm Semiconductor

HIGH SPEED SWITCHING, 80V 100MA, SOT-723, ANODE COMMON SWITCHING DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationDAP222ZMT2L
Current - Average Rectified (Io) (per Diode)100 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration1 Pair Common Anode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-723
QualificationAEC-Q101
Reverse Recovery Time (trr)4 ns
Speed200 mA
SpeedAny Speed
Supplier Device PackageVMD3
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If [Max]1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 13457$ 0.39
NewarkEach (Supplied on Cut Tape) 1$ 0.39
10$ 0.26
25$ 0.24
50$ 0.21
100$ 0.18
250$ 0.16
500$ 0.13
1000$ 0.10

Description

General part information

DAP222ZM Series

DAP222ZM is small mold type package switching diode, suitable for high speed switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Anti-Whisker formation - Diodes

Package Information

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Part Explanation

Application Note

Package Dimensions

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Create Symbols for PSpice Models

Models

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Diode Types and Applications

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

List of Diode Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article