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Discrete Semiconductor Products

RB551VM-40TE-17

Active
Rohm Semiconductor

S SIGNAL SCHOTTKY DIODE, 40V/SOD-323FL ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsImpedance Characteristics of Bypass CapacitorPower Loss and Thermal Design of Diodes+30
Product dimension image
Discrete Semiconductor Products

RB551VM-40TE-17

Active
Rohm Semiconductor

S SIGNAL SCHOTTKY DIODE, 40V/SOD-323FL ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsImpedance Characteristics of Bypass CapacitorPower Loss and Thermal Design of Diodes+30

Technical Specifications

Parameters and characteristics for this part

SpecificationRB551VM-40TE-17
Current - Average Rectified (Io)200 mA
Current - Reverse Leakage @ Vr300 µA
Mounting TypeSurface Mount
Operating Temperature - Junction125 °C
Package / CaseSOD-323F, SC-90
SpeedAny Speed
Speed200 mA
Supplier Device PackageUMD2
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If430 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.36
10$ 0.22
100$ 0.14
500$ 0.10
1000$ 0.09
Tape & Reel (TR) 3000$ 0.05
6000$ 0.05
9000$ 0.05
NewarkEach (Supplied on Cut Tape) 1$ 0.37
10$ 0.23
25$ 0.18
50$ 0.14
100$ 0.09
250$ 0.09
500$ 0.09
1000$ 0.08

Description

General part information

RB551VM-40 Series

RB551VM-40 is super low VFhigh reliability Schottky Barrier Diode, suitable for small current rectification.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Explanation for Marking

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Rectifier Diodes

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Diode Types and Applications

Technical Article

How to Create Symbols for PSpice Models

Models

Taping Information

Package Information

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Reliability Test Result

Manufacturing Data

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Inner Structure

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design