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RFN2L4STE25
Discrete Semiconductor Products

RFN2L4STE25

NRND
Rohm Semiconductor

DIODE STANDARD 400V 1.5A PMDS

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RFN2L4STE25
Discrete Semiconductor Products

RFN2L4STE25

NRND
Rohm Semiconductor

DIODE STANDARD 400V 1.5A PMDS

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN2L4STE25
Current - Average Rectified (Io)1.5 A
Current - Reverse Leakage @ Vr1 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseDO-214AC, SMA
Reverse Recovery Time (trr)30 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDS
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]400 V
Voltage - Forward (Vf) (Max) @ If1.5 A
Voltage - Forward (Vf) (Max) @ If [Max]1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4627$ 0.78

Description

General part information

RFN2L4S Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

About Export Regulations

Export Information

Taping Information

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Inner Structure

Package Information

RFN2L4S Data Sheet

Data Sheet

What is a Thermal Model? (Diode)

Thermal Design

Explanation for Marking

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Rectifier Diodes

Technical Article

Package Dimensions

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

ESD Data

Characteristics Data

Constitution Materials List

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Diode Types and Applications

Technical Article

About Flammability of Materials

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification