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Discrete Semiconductor Products

RD3T075CNTL1

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Rohm Semiconductor

MOSFET N-CH 200V 7.5A TO252

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Discrete Semiconductor Products

RD3T075CNTL1

Active
Rohm Semiconductor

MOSFET N-CH 200V 7.5A TO252

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3T075CNTL1
Current - Continuous Drain (Id) @ 25°C7.5 A
Drain to Source Voltage (Vdss)200 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs15 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]755 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)52 W
Rds On (Max) @ Id, Vgs [Max]325 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id5.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.40
10$ 1.15
100$ 0.89
500$ 0.76
1000$ 0.62
Digi-Reel® 1$ 1.40
10$ 1.15
100$ 0.89
500$ 0.76
1000$ 0.62
N/A 390$ 1.80
Tape & Reel (TR) 2500$ 0.58
5000$ 0.55
12500$ 0.53

Description

General part information

RD3T075CN Series

RD3T075CN is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

How to Use LTspice® Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

RD3T075CN Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Types and Features of Transistors

Application Note

Part Explanation

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Report of SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RD3T075CN ESD Data

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

How to Create Symbols for PSpice Models

Models

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

TO-252_TL1 Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design