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760-FCBGA
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AM5729BABCXEA

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Texas Instruments

MPU AM572X RISC 32BIT 1.5GHZ 760-PIN FCBGA TRAY

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760-FCBGA
Integrated Circuits (ICs)

AM5729BABCXEA

Active
Texas Instruments

MPU AM572X RISC 32BIT 1.5GHZ 760-PIN FCBGA TRAY

Technical Specifications

Parameters and characteristics for this part

SpecificationAM5729BABCXEA
Additional InterfacesCAN, McASP, PCIe, QSPI, I2C, UART, MMC/SD/SDIO, HDQ/1-Wire\, EBI/EMI, McSPI
Co-Processors/DSPIPU, IVA, GPU, BB2D, VPE, DSP
Core ProcessorARM® Cortex®-A15
EthernetGbE (2)
Graphics AccelerationTrue
Mounting TypeSurface Mount
Number of Cores/Bus Width [custom]32 Bit
Number of Cores/Bus Width [custom]2
Operating Temperature [custom]-40 °C, 105 °C
Package / CaseFCBGA, 760-BFBGA
RAM ControllersDDR3, SRAM
SATA3 Gbps
Speed1.5 GHz
Supplier Device Package760-FCBGA (23x23)
USB [custom]USB 2.0 (1), USB 3.0 (1)
Voltage - I/O3.3 V, 1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 60$ 89.49
Texas InstrumentsEIAJ TRAY (5+1) 1$ 82.41
100$ 79.93
250$ 66.55
1000$ 61.96

Description

General part information

AM5729 Series

AM572x Sitara™ processors are Arm applications processors built to meet the intense processing needs of modern embedded products.

AM572x devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set. Cryptographic acceleration is available in every AM572x device.

Programmability is provided by dual-core Arm®Cortex®-A15 RISC CPUs with Arm®Neon™ extension, and two TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with 4x EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSPs and coprocessors, thus reducing the complexity of the system software.

Documents

Technical documentation and resources

PRU-ICSS EtherCAT Slave Troubleshooting Guide

Application note

PRU Read Latencies (Rev. A)

Application note

AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne

Application note

Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. G)

Application note

Bringing deep learning to embedded systems (Rev. A)

White paper

AM572x GP EVM Power Simulations

Application note

Common EOS pitfalls in board design

Application note

Processor SDK RTOS Audio Benchmark Starter Kit

Application note

How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS

User guide

AM574x, AM572x, and AM571x Compatibility Guide (Rev. E)

Application note

2D Object Recognition for Industrial Machine Vision with Processor SDK on Sitara

Application note

Virtualization for embedded industrial systems (Rev. B)

White paper

AM572x Thermal Considerations (Rev. A)

Application note

AM572x Power Estimation Tool

Application note

AM572x Sitara™ Processors Silicon Revision 2.0 datasheet (Rev. G)

Data sheet

IODELAY Application Note for AM57xx Devices (Rev. A)

Application note

Industrial Communication Protocols Supported on Sitara™ Processors (Rev. E)

Application note

Processor-SDK RTOS Power Management and Measurement

Application note

Maximizing machine-learning inference at the edge

Technical article

PRU Assembly Instruction User Guide

User guide

AM572x Power Consumption Summary

Application note

AM571x/AM572x/AM574x PCB Escape Routing (Rev. A)

Application note

Keystone EDMA FAQ

Application note

HSR/PRP Solutions on Sitara Processors for Grid Substation Communication

Application note

AM572x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware UG (Rev. E)

EVM User's guide

TI DSP Benchmarking

Application note

AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E)

Application note

Sitara™ AM5x processor with ARM® Cortex™-A15 core (Rev. A)

Product overview

High-Speed Interface Layout Guidelines (Rev. J)

Application note

The Yocto Project:Changing the way embedded Linux software solutions are develop

White paper

Adding Real-Time Communication to Linux (Rev. A)

Application brief

TPS659037 user's guide to power AM574x, AM572x, and AM571x (Rev. F)

User guide

PRU-ICSS Feature Comparison (Rev. G)

Application note

From Start to Finish: A Product Development Roadmap for Sitara™ Processors

More literature

Designing professional audio mixers for every scenario

White paper

Thermal Design Guide for DSP and Arm Application Processors (Rev. B)

Application note

McASP Design Guide - Tips, Tricks, and Practical Examples

Application note

AM572x Sitara Processor Technical Reference Manual (Rev. L)

User guide

AM57xx Hardware Design Guide

Application note

Plastic Ball Grid Array [PBGA] Application Note (Rev. B)

Application note

AM572x Industrial Development Kit Quick Start Guide (Rev. B)

More literature

Time Sensitive Networking for Industrial Automation (Rev. C)

White paper

Ensuring real-time predictability (Rev. B)

White paper

PRU-ICSS Getting Started Guide on TI-RTOS (Rev. A)

Application note

PRU-ICSS Getting Starting Guide on Linux (Rev. A)

Application note

AM57x Schematic Checklist (Rev. B)

Application note

Linaro Speeds Development in TI Linux SDKs

White paper

Scalable Solutions for HMI

White paper

AM57xx BGA PCB Design

Application note

MMC DLL Tuning (Rev. B)

Application note

Mainline Linux™ ensures stability and innovation

White paper

AM572x Sitara Processors Silicon Errata (Silicon Revision 2.0, 1.1) (Rev. N)

Errata

Enable security and amp up chip performance w/ hardware-accelerated cryptograpy (Rev. A)

White paper

Calculating Useful Lifetimes of Embedded Processors (Rev. B)

Application note

PRU-ICSS / PRU_ICSSG Migration Guide

Application note

Ethernet PHY Configuration Using MDIO for Industrial Applications (Rev. A)

Application note

TI’s processors leading the way in embedded analytics

White paper

Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni

Application note

Secure Boot on embedded Sitara™ processors (Rev. A)

White paper

AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

Application note

DSPLIB for Processor SDK RTOS

Application note