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ROHM QH8JC5TCR
Discrete Semiconductor Products

QH8MA4TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 9A, TSMT8

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ROHM QH8JC5TCR
Discrete Semiconductor Products

QH8MA4TCR

Active
Rohm Semiconductor

MOSFET, N AND P-CH, 30V, 9A, TSMT8

Technical Specifications

Parameters and characteristics for this part

SpecificationQH8MA4TCR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C8 A, 9 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs15.5 nC
Input Capacitance (Ciss) (Max) @ Vds640 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.5 W
Rds On (Max) @ Id, Vgs16 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1972$ 1.41
NewarkEach (Supplied on Cut Tape) 1$ 1.28
10$ 0.83
25$ 0.75
50$ 0.67
100$ 0.59
250$ 0.54
500$ 0.48
1000$ 0.41

Description

General part information

QH8MA4 Series

The Middle Power MOSFET QH8MA4 is suitable for switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

P-channel Power MOSFETs selection guide

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

ESD Data

Characteristics Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification