Zenode.ai Logo
Beta
ROHM DTC023YUBTL
Discrete Semiconductor Products

DTA014EUBTL

Active
Rohm Semiconductor

PNP, SOT-323FL, R1=R2 POTENTIAL DIVIDER TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Deep-Dive with AI

Search across all available documentation for this part.

ROHM DTC023YUBTL
Discrete Semiconductor Products

DTA014EUBTL

Active
Rohm Semiconductor

PNP, SOT-323FL, R1=R2 POTENTIAL DIVIDER TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDTA014EUBTL
Current - Collector (Ic) (Max) [Max]50 mA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]35
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSC-85
Power - Max [Max]200 mW
Resistor - Base (R1)10 kOhms
Resistor - Emitter Base (R2)10 kOhms
Supplier Device PackageUMT3F
Transistor TypePNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic150 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.29
10$ 0.20
100$ 0.10
500$ 0.08
1000$ 0.06
Digi-Reel® 1$ 0.29
10$ 0.20
100$ 0.10
500$ 0.08
1000$ 0.06
Tape & Reel (TR) 3000$ 0.03
6000$ 0.03
9000$ 0.03
NewarkEach (Supplied on Cut Tape) 1$ 0.25
10$ 0.15
25$ 0.12
50$ 0.09
100$ 0.06

Description

General part information

DTA014 Series

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

What Is Thermal Design

Thermal Design

ESD Data

Characteristics Data

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Part Explanation

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Package Dimensions

Package Information

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

UMT3 T106 Taping Spec

Datasheet

UMT3 Part Marking

Related Document