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Integrated Circuits (ICs)

BD63001AMUV-E2

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Rohm Semiconductor

THREE-PHASE BRUSHLESS MOTOR PRE-DRIVER

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Product dimension image
Integrated Circuits (ICs)

BD63001AMUV-E2

Active
Rohm Semiconductor

THREE-PHASE BRUSHLESS MOTOR PRE-DRIVER

Technical Specifications

Parameters and characteristics for this part

SpecificationBD63001AMUV-E2
ApplicationsGeneral Purpose
Current - Output30 mA
FunctionDriver
InterfaceLogic
Motor Type - AC, DCBrushless DC (BLDC)
Mounting TypeSurface Mount
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Output ConfigurationPre-Driver - Half Bridge (3)
Package / Case24-VFQFN Exposed Pad
Supplier Device PackageVQFN020V4040
TechnologyPower MOSFET
Voltage - Load [Max]28 V
Voltage - Load [Min]6 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.72
10$ 2.44
25$ 2.30
100$ 1.96
250$ 1.84
500$ 1.61
1000$ 1.34
Digi-Reel® 1$ 2.72
10$ 2.44
25$ 2.30
100$ 1.96
250$ 1.84
500$ 1.61
1000$ 1.34
N/A 2363$ 2.42
Tape & Reel (TR) 2500$ 1.14

Description

General part information

BD63001 Series

BD63001AMUV is a Three-Phase Brushless Motor Predriver that uses upper Pch and lower Nch MOS transistor for an external output power transistor. It generates a driving signal from the Hall sensor and drives PWM through the input control signal. In addition, the supply voltage that can be applied is 12V or 24V, it has various controls and built-in protection functions, making it useful for a variety of purposes. Since the IC adopts small packages, it can be used on small diameter motors.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation

Package Information

Five Steps for Successful Thermal Design of IC

White Paper

UL94 Flame Classifications of Mold Compound

Environmental Data

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Thermal Resistance

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Factory Information

Manufacturing Data

VQFN024V4040 Package Information

Package Information

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

BD63001AMUV Data Sheet

Data Sheet

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance with the ELV directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

12V power supply, 3 hall sensor support, Three-phase brushless motor drive with Microcontroller system Reference Design

Reference Design

Judgment Criteria of Thermal Evaluation

Thermal Design