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TO-220FN(2PIN)

Discrete Semiconductor Products

RFUH25TB3SNZC9

Active

Rohm Semiconductor

RECTIFIER, 350V, 20A, TO-220FN ROHS COMPLIANT: YES

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Search across all available documentation for this part.

DocumentsAnti-Whisker formation - Diodes Part Explanation +41

TO-220FN(2PIN)

Discrete Semiconductor Products

RFUH25TB3SNZC9

Active

Rohm Semiconductor

RECTIFIER, 350V, 20A, TO-220FN ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsAnti-Whisker formation - Diodes Part Explanation +41

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RFUH25TB3SNZC9

Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Through Hole
Operating Temperature - Junction	150 ¯C
Package / Case	TO-220-2 Full Pack
Reverse Recovery Time (trr)	30 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-220FN-2
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	350 V
Voltage - Forward (Vf) (Max) @ If	1.45 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	847	$ 2.49
	Tube	1	$ 1.75
		50	$ 0.85
		100	$ 0.77
		500	$ 0.70
Newark	Each	1	$ 2.37
		10	$ 1.67
		100	$ 0.98
		500	$ 0.85
		1000	$ 0.77
		3000	$ 0.76
		5000	$ 0.73

Description

General part information

RFUH25 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

Anti-Whisker formation - Diodes

Package Information

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Judgment Criteria of Thermal Evaluation

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Package Dimensions

Package Information

List of Diode Package Thermal Resistance

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Basics of Thermal Resistance and Heat Dissipation

Compliance of the RoHS directive

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Moisture Sensitivity Level - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Inner Structure

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

RFUH25TB3SNZ Data Sheet

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Taping Information

Package Information

How to Select Rectifier Diodes

Technical Article

PCB Layout Thermal Design Guide

Notes for Temperature Measurement Using Thermocouples

Power Loss and Thermal Design of Diodes

RFUH25TB3SNZ ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Diode)

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Explanation for Marking

Package Information

What Is Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

RFUH25 Series

Super Fast Recovery Diode

Part	Package / Case	Current - Reverse Leakage @ Vr	Voltage - Forward (Vf) (Max) @ If	Voltage - DC Reverse (Vr) (Max) [Max]	Supplier Device Package	Reverse Recovery Time (trr)	Speed	Operating Temperature - Junction	Mounting Type	Technology
Rohm Semiconductor RFUH25TB3SNZC9	TO-220-2 Full Pack	10 µA	1.45 V	350 V	TO-220FN-2	30 ns	200 mA 500 ns	150 ¯C	Through Hole	Standard
Rohm Semiconductor RFUH25NS3STL	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB	10 µA	1.45 V	350 V	LPDS	30 ns	200 mA 500 ns	150 ¯C	Surface Mount	Standard