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Discrete Semiconductor Products

RGW50TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 25A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGW50TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 25A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW50TS65DGC13
Current - Collector (Ic) (Max)50 A
Current - Collector Pulsed (Icm)100 A
Gate Charge73 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]156 W
Supplier Device PackageTO-247GE
Switching Energy390 µJ, 430 µJ
Td (on/off) @ 25°C35 ns, 102 ns
Test Condition400 V, 25 A, 10 Ohm, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.89
10$ 4.39
25$ 4.15
120$ 3.60
360$ 3.41
600$ 3.06
1080$ 2.58
2520$ 2.45
NewarkEach 1$ 5.08
10$ 4.26
25$ 4.02
50$ 3.73
100$ 3.44
250$ 3.26

Description

General part information

RGW50TS65D Series

The RGW50TS65D is a fast switching speed IGBT, suitable for PFC, solar inverter, UPS, welding and IH. The RGTV/RGW series is a highly efficient series that is optimized the trade-off relationship between conduction loss and switching speed. In addition, optimizing the internal design allowed to achieve smooth switching characteristics that decrease voltage overshoot. It contributes to reduce the number of parts required along with design load.

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Anti-Whisker formation

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Administration Regulations (EAR)

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level

Package Information

RGW50TS65D Data Sheet

Data Sheet

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Types and Features of Transistors

Application Note