This trench Schottky rectifier in the dual flag SO−8 flat leadpackage offers designers a unique degree of versatility and designfreedom. The two devices are electrically independent and can be usedseparately, as common cathode, as common anode or in series as afunction of board level layout. The exposed pad design provides lowthermal resistance. The clip attach design creates a package with veryefficient die size to board area ratio. While thermal performance isnearly the same as the DPAK package height and board footprint areless than half.Trench Schottky technology provides a superior forward voltage/leakage tradeoff compared to planar Schottky. The reverse switchingcharacteristics are extremely stable over temperature minimizingswitching power loss in high frequency applications.