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Discrete Semiconductor Products

DTD123YCT116

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Rohm Semiconductor

NPN, SOT-23, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Product schematic image
Discrete Semiconductor Products

DTD123YCT116

Active
Rohm Semiconductor

NPN, SOT-23, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationDTD123YCT116
Current - Collector (Ic) (Max) [Max]500 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]56
Frequency - Transition200 MHz
Mounting TypeSurface Mount
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Resistor - Base (R1)2.2 kOhm
Resistor - Emitter Base (R2)10 kOhms
Supplier Device PackageSST3
Transistor TypeNPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic [Max]300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.36
10$ 0.25
100$ 0.12
500$ 0.10
1000$ 0.07
Digi-Reel® 1$ 0.36
10$ 0.25
100$ 0.12
500$ 0.10
1000$ 0.07
Tape & Reel (TR) 3000$ 0.06
6000$ 0.06
9000$ 0.05
30000$ 0.05
75000$ 0.04
150000$ 0.04

Description

General part information

DTD123 Series

DTD123YC is an digital transistor (Resistor built-in type transistor). The bias resistors consist of thin-film resistors with complete isolation to allow negative.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

Constitution Materials List

Environmental Data

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

DTD123YC Data Sheet

Data Sheet

How to Use LTspice® Models

Schematic Design & Verification

Package Dimensions

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Inner Structure

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

ESD Data

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

Explanation for Marking

Package Information

Part Explanation

Application Note