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Discrete Semiconductor Products

RF2001NS3DFHTL

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Rohm Semiconductor

FAST RECOVERY DIODES (CORRESPONDS TO AEC-Q101)

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Product schematic image
Discrete Semiconductor Products

RF2001NS3DFHTL

Active
Rohm Semiconductor

FAST RECOVERY DIODES (CORRESPONDS TO AEC-Q101)

Technical Specifications

Parameters and characteristics for this part

SpecificationRF2001NS3DFHTL
Current - Average Rectified (Io) (per Diode)20 A
Current - Reverse Leakage @ Vr10 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageLPDS
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]300 V
Voltage - Forward (Vf) (Max) @ If [Max]1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 592$ 2.41
MouserN/A 1$ 2.37
10$ 1.67
100$ 1.33
500$ 1.11
1000$ 0.92
2000$ 0.84

Description

General part information

RF2001NS3DFH Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

List of Diode Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

RF2001NS3DFH Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Inner Structure

Package Information

How to Select Rectifier Diodes

Technical Article

Diode Types and Applications

Technical Article

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Constitution Materials List

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design