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Integrated Circuits (ICs)

SN74ABT162827ADLR

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Texas Instruments

20-CH, 4.5-V TO 5.5-V BUFFERS WITH TTL-COMPATIBLE CMOS INPUTS AND 3-STATE OUTPUTS

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SSOP (DL)
Integrated Circuits (ICs)

SN74ABT162827ADLR

Active
Texas Instruments

20-CH, 4.5-V TO 5.5-V BUFFERS WITH TTL-COMPATIBLE CMOS INPUTS AND 3-STATE OUTPUTS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74ABT162827ADLR
Current - Output High, Low [custom]12 mA
Current - Output High, Low [custom]12 mA
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element10
Number of Elements2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type3-State
Package / Case0.295 in
Package / Case56-BSSOP
Package / Case7.5 mm
Supplier Device Package56-SSOP
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.88
10$ 4.38
25$ 4.14
100$ 3.59
250$ 3.40
500$ 3.05
Digi-Reel® 1$ 4.88
10$ 4.38
25$ 4.14
100$ 3.59
250$ 3.40
500$ 3.05
Tape & Reel (TR) 1000$ 2.58
2000$ 2.45
LCSCPiece 1$ 6.01
10$ 5.87
30$ 5.78
100$ 5.69
Texas InstrumentsLARGE T&R 1$ 3.68
100$ 3.23
250$ 2.26
1000$ 1.82

Description

General part information

SN74ABT162827A Series

The ’ABT162827A devices are noninverting 20-bit buffers composed of two 10-bit buffers with separate output-enable signals. For either 10-bit buffer, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer are in the high-impedance state.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.